Digi ConnectCore 8M Nano > System-On-Modules

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Digi ConnectCore 8M Nano 요약정보 및 구매

MODEL : Digi ConnectCore 8M Nano

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브랜드	DIGI
판매가격	전화문의 (031-713-5988)
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Digi ConnectCore® 8M 나노

NXP i.MX 8M Nano 프로세서 기반인 임베디드 시스템-온-모듈 Digi ConnectCore® 8M Nano은 산업용 IoT 어플리케이션에 적합하도록 긴 수명과 확장성을 위하여 설계되었습니다.

> 산업용 I.MX 8M 나노 쿼드/싱글 코어 시스템-온-모듈

> Digi SMTplus® 폼 팩터(40mm x 45mm)로 최고의 신뢰성 및 설계 자유도 제공

> 하드웨어 및 소프트웨어 지원을 통한 전원 관리로 저전력 설계 > 하드웨어 가속을 지원하는 멀티 디스플레이 및 카메라 기능> 사전 인증된 듀얼 밴드 802.11a/b/g/n/ac 1x1 및 Bluetooth® 5 연결
> 완벽한 셀룰러 모뎀 및 Digi XBee 통합 > 클라우드 및 엣지 컴퓨팅 서비스 통합 > Digi TrustFence로 장치 보안, ID 및 개인 정보 보호 기능 내장 > Digi Remote Manager를 통한 원격 모니터링 및 관리
> Yocto 프로젝트 리눅스 지원

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NXP® i.MX 8M Nano 어플리케이션 프로세서를 기반으로 하는 Digi ConnectCore 8M Nano는 통합 시스템-온-모듈(SOM) 플랫폼입니다. Nano는 IoT (Internet of Things), HMI (human-machine interface), 장비 모니터링, 오디오/음성, 엣지 컴퓨팅 및 기계 학습(예:이상 감지)을 포함한 광범위한 산업, 의료, 농업 및 운송 어플리케이션을 위해 설계되었습니다.

Digi ConnectCore 8M Nano는 최대 4개의 전력 효율적인 Arm® Cortex®-A53 코어와 1개의 Cortex-M7 코어를 갖추고 있어 높은 수준의 성능을 유지하면서 전력 소비를 최소화할 수 있습니다. 이 SOM은 산업용 안정성을 자랑하며 임베디드 장치의 10년 이상의 제품 수명 주기를 위해 설계되었습니다. OEM은 사전 인증된 무선 연결, 원격 관리, 클라우드 통합 및 Yocto 프로젝트 기반의 완전한 리눅스 소프트웨어 플랫폼을 활용하여 R&D 및 개발 비용을 낮추고 총 소유 비용을 절감할 수 있습니다. 또한 내장형 Digi TrustFence를 통해 OEM 개발자는 중요한 보안 및 데이터 개인 정보 보호 기능을 제품에 통합할 수 있습니다.

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	Digi ConnectCore MP1 Intelligent, wireless and secure embedded system-on-module based on the STM32MP1 MPU family, with turnkey Linux support in the robust Digi SMTplus standard form factor	Digi ConnectCore 93 Embedded, wireless system-on-module based on the NXP i.MX 93 processor, with AI/ML NPU, designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8M Mini Embedded system-on-module based on the NXP i.MX 8M Mini processor with built-in Video Processing Unit (VPU); designed for longevity and scalability in industrial IoT applications.	Digi ConnectCore 8M Nano Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8X Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications	Digi ConnectCore 6+ NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless	Digi ConnectCore 6UL Intelligent and connected embedded system-on-module based on the NXP i.MX6 UL, with turnkey Linux software support in a stamp-sized form factor
	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT
Ethernet	10/100 M or Gigabit Ethernet GMAC IEEE 1588v2, MII/RMII/GMII/RGMII	2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)	10/100/1000M Ethernet + AVB	1x 10/100/1000M Ethernet + AVB	2x 10/100/1000M Ethernet + AVB	10/100/1000 Mbit/s	Dual 10/100 Mbit/s
Graphics	3D GPU (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, parallel LCD-TFT controller, MIPI® DSI 2 data lanes	2D GPU, 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY, 1x 720p 60 LVDS (4-lane), 18-bit parallel RGB	Graphics Processing Unit: GCNanoUltra for 3D acceleration, GC320 for 2D acceleration, LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI, DSI MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface); Video Processing Unit: 1080 p 60 HEVC H.265 (decode), VP9, H.264, VP8 (encode/decode)	GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)	Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging	2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)
Operating Temperature	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
Processor Family	ST STM32MP157C, Arm® dual Cortex®-A7 at 650 MHz Cortex®-M4 at 209 MHz with FPU/MPU, 3D GPU, secure boot, crypto engine	NXP® i.MX 93 Up to 2x Cortex®-A55 cores at 1.7 GHz 1x Cortex-M33 core at 250 MHz core for real-time processing	NXP® i.MX 8M Mini Four Cortex®-A53 cores @ 1.6 GHz Cortex-M4 core @ 400 MHz	NXP® i.MX 8M Nano 1-4x Cortex®-A53 cores @ 1.4 GHz 1x Cortex-M7 core @ 600 MHz	NXP® i.MX 8QuadXPlus Up to 4x Cortex®-A35 cores @ 1.2 GHz 1x Cortex-M4F core @ 264 MHz 1x Tensilica® Hi-Fi 4 DSP	NXP® i.MX6 Plus 4x Cortex®-A9 @ 1.2 GHz	NXP i.MX6UL-2 1x Cortex-A7 @ 528 MHz
Wireless	Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with full temperature range; Bluetooth® 5	Wi-Fi 6 802.11ax dual-band 1x1 wireless, Bluetooth® 5.2, 802.15.4	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5
Flash	Up to 1 GB SLC NAND	Up to 32 GB eMMC	Up to 8 GB eMMC	Up to 8 GB eMMC	Up to 64 GB eMMC	Up to 64 GB eMMC	Up to 2 GB NAND (SLC)
RAM	Up to 1 GB DDR3L	Up to 2 GB of LPDDR4 / LPDDR4X	Up to 2 GB LPDDR4	Up to 1 GB of LPDDR4	Up to 4 GB LPDDR4	Up to 2 GB DDR3	Up to 1 GB DDR3
Software Support	Digi Embedded Yocto Linux	Digi Embedded Yocto Linux	Yocto Project Linux, Android	Yocto Project® Linux®	Yocto Project® Linux®, Android™	Yocto Project® Linux®, Android™	Yocto Project® Linux®
Other	Digi Microcontroller Assist™, ultra-low power Arm® Cortex®-M0+	AI/ML Arm Ethos U65 micro neural processor; Digi Microcontroller Assist™ independent Cortex-M0+ microcontroller subsystem supporting ultra-low power modes	Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	-	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)	Digi Microcontroller Assist™ (MCA), Secure Element (SE)
Processor Cores	-	-	4	4	Up to 4	Up to 4	1
Processor Architecture	-	-	64-bit	64-Bit	64-Bit	32-Bit	32-Bit
I/O	-	-	USB 2.0 OTG controllers with integrated PHY interfaces, three Ultra Secure Digital Host Controller (uSDHC) interfaces, Gigabit Ethernet controller, four Universal Asynchronous Receiver / Transmitter (UART) modules, four I2C modules, three SPI modules, PCI Express 2.0 (PCIe)	1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules	1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus	1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)
Audio	-	-	5x SAI/I2S, 1x S/PDIF Rx/Tx	5x SAI/I2S, 1x S/PDIF Rx/Tx	4x SAI//I2S, 1x ESAI, 1x S/PDIF Rx/Tx	ESAI, I2S/SSI x3	3x I2S/SAI, 1 x S/PDIF Tx/Rx

· 제품 사양

SPECIFICATIONS	Digi ConnectCore® 8M Nano
APPLICATION PROCESSOR	NXP® i.MX8 Nano Up to 4x Cortex®-A53 cores @ 1.4 GHz 1x Cortex-M7 core @ 600 MHz core for real-time processing
MEMORY	Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC	NXP PCA9450A
GRAPHICS	Graphic Processing Unit: GC7000UL with OpenCL and Vulkan support 2 shader 123 million triangles / sec 0.8 giga pixel / sec 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL Shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)
SECURITY	Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
PERIPHERALS/ INTERFACES	1x USB 2.0 OTG controllers with integrated PHY interfaces 3x Ultra Secure Digital Host Controller (uSDHC) interfaces 4x Universal Asynchronous Receiver / Transmitter (UART) modules 4x I2C modules 3x SPI modules 1x Quad SPI 10x PWM channels 1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels 5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces 1x S/PDIF input and output, including a raw capture input mode 8-channel Pulse Density Modulation (PDM) input Up to 112 GPIOs
ETHERNET	1x 10/100/1000M Ethernet + AVB
WI-FI	1x1 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH	Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST	Digi Microcontroller Assist™ Independent Cortex-M0+ microcontroller subsystem Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
STORAGE TEMPERATURE	-50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY	5% to 90% (non-condensing)
RADIO APPROVALS	US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY	FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION	Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS	118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)

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