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Digi ConnectCore® 8X 요약정보 및 구매

MODEL : Digi ConnectCore® 8X

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Digi ConnectCore® 8X

산업용 IoT 어플리케이션에 적합하도록 확장 가능한 듀얼/쿼드 코어 성능을 갖춘 NXP i.MX 8X 기반의 지능적이고 확장성 있는 임베디드 시스템 온 모듈입니다.

> 산업용 i.MX 8X 쿼드 / 듀얼 코어 SOM 및 SBC 플랫폼 제품군

> 최고의 안정성과 디자인의 자유를 위한 Digi SMTplus® 폼 팩터 (40mm x 45mm)

> 전원 관리 – 저전력 설계를 위한 하드웨어 및 소프트웨어 지원

> 하드웨어 가속 기능을 갖춘 다중 디스플레이 및 카메라 기능

> 사전 인증 된 듀얼 밴드 802.11a / b / g / n / ac 2x2 및 Bluetooth® 5 연결

> 완벽한 셀룰러 모뎀 및 Digi XBee3 통합

> 클라우드 및 엣지 컴퓨팅 서비스 통합

> Digi TrustFence를 통한 내장 장치 보안

> Yocto 프로젝트 및 안드로이드 지원

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Digi ConnectCore® 8X는 40mm x 45mm 크기의 안전하고 경제적인 커넥티드 시스템 온 모듈 플랫폼을 제공합니다. Digi SMTplus® 표면 실장 폼 팩터를 사용하면 입증되고 사용하기 쉬운 에지 캐스팅 SMT 기술을 활용하여 단순화된 설계 통합을 선택하거나 거의 모든 인터페이스에 액세스하여 궁극적인 설계 유연성을 위한 다용도 LGA 옵션을 선택할 수 있습니다.

NXP i.MX 8X 애플리케이션 프로세서를 기반으로 하는 이 모듈은 안전한 연결 장치를 위한 지능형 통신 엔진입니다. ConnectCore 8X는 스트리밍 비디오 / 오디오 장치, 음성 제어 및 일반적인 HMI 솔루션의 개발을 빠르게 시작할 수 있도록 도와줍니다. ConnectCore 8X는 1x USB 3.0 포트, 듀얼 기가비트 이더넷, PCIe 3.0 및 사전 인증된 듀얼 밴드 2x2 MU-MIMO WLAN을 포함한 다양한 고성능 상호 연결 옵션을 제공하므로 광범위한 임베디드 및 IoT 어플리케이션 개발에 이상적입니다.

Compare SOMs

	Digi ConnectCore MP1 Intelligent, wireless and secure embedded system-on-module based on the STM32MP1 MPU family, with turnkey Linux support in the robust Digi SMTplus standard form factor	Digi ConnectCore 93 Embedded, wireless system-on-module based on the NXP i.MX 93 processor, with AI/ML NPU, designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8M Mini Embedded system-on-module based on the NXP i.MX 8M Mini processor with built-in Video Processing Unit (VPU); designed for longevity and scalability in industrial IoT applications.	Digi ConnectCore 8M Nano Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications	Digi ConnectCore 8X Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications	Digi ConnectCore 6+ NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless	Digi ConnectCore 6UL Intelligent and connected embedded system-on-module based on the NXP i.MX6 UL, with turnkey Linux software support in a stamp-sized form factor
	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT	VIEW PRODUCT
Ethernet	10/100 M or Gigabit Ethernet GMAC IEEE 1588v2, MII/RMII/GMII/RGMII	2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)	10/100/1000M Ethernet + AVB	1x 10/100/1000M Ethernet + AVB	2x 10/100/1000M Ethernet + AVB	10/100/1000 Mbit/s	Dual 10/100 Mbit/s
Graphics	3D GPU (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, parallel LCD-TFT controller, MIPI® DSI 2 data lanes	2D GPU, 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY, 1x 720p 60 LVDS (4-lane), 18-bit parallel RGB	Graphics Processing Unit: GCNanoUltra for 3D acceleration, GC320 for 2D acceleration, LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI, DSI MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface); Video Processing Unit: 1080 p 60 HEVC H.265 (decode), VP9, H.264, VP8 (encode/decode)	GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)	Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders	Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging	2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)
Operating Temperature	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design	Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
Processor Family	ST STM32MP157C, Arm® dual Cortex®-A7 at 650 MHz Cortex®-M4 at 209 MHz with FPU/MPU, 3D GPU, secure boot, crypto engine	NXP® i.MX 93 Up to 2x Cortex®-A55 cores at 1.7 GHz 1x Cortex-M33 core at 250 MHz core for real-time processing	NXP® i.MX 8M Mini Four Cortex®-A53 cores @ 1.6 GHz Cortex-M4 core @ 400 MHz	NXP® i.MX 8M Nano 1-4x Cortex®-A53 cores @ 1.4 GHz 1x Cortex-M7 core @ 600 MHz	NXP® i.MX 8QuadXPlus Up to 4x Cortex®-A35 cores @ 1.2 GHz 1x Cortex-M4F core @ 264 MHz 1x Tensilica® Hi-Fi 4 DSP	NXP® i.MX6 Plus 4x Cortex®-A9 @ 1.2 GHz	NXP i.MX6UL-2 1x Cortex-A7 @ 528 MHz
Wireless	Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with full temperature range; Bluetooth® 5	Wi-Fi 6 802.11ax dual-band 1x1 wireless, Bluetooth® 5.2, 802.15.4	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5	802.11a/b/g/n/ac, Bluetooth® 5
Flash	Up to 1 GB SLC NAND	Up to 32 GB eMMC	Up to 8 GB eMMC	Up to 8 GB eMMC	Up to 64 GB eMMC	Up to 64 GB eMMC	Up to 2 GB NAND (SLC)
RAM	Up to 1 GB DDR3L	Up to 2 GB of LPDDR4 / LPDDR4X	Up to 2 GB LPDDR4	Up to 1 GB of LPDDR4	Up to 4 GB LPDDR4	Up to 2 GB DDR3	Up to 1 GB DDR3
Software Support	Digi Embedded Yocto Linux	Digi Embedded Yocto Linux	Yocto Project Linux, Android	Yocto Project® Linux®	Yocto Project® Linux®, Android™	Yocto Project® Linux®, Android™	Yocto Project® Linux®
Other	Digi Microcontroller Assist™, ultra-low power Arm® Cortex®-M0+	AI/ML Arm Ethos U65 micro neural processor; Digi Microcontroller Assist™ independent Cortex-M0+ microcontroller subsystem supporting ultra-low power modes	Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA	-	Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)	Digi Microcontroller Assist™ (MCA), Secure Element (SE)
Processor Cores	-	-	4	4	Up to 4	Up to 4	1
Processor Architecture	-	-	64-bit	64-Bit	64-Bit	32-Bit	32-Bit
I/O	-	-	USB 2.0 OTG controllers with integrated PHY interfaces, three Ultra Secure Digital Host Controller (uSDHC) interfaces, Gigabit Ethernet controller, four Universal Asynchronous Receiver / Transmitter (UART) modules, four I2C modules, three SPI modules, PCI Express 2.0 (PCIe)	1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules	1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG	MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus	1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)
Audio	-	-	5x SAI/I2S, 1x S/PDIF Rx/Tx	5x SAI/I2S, 1x S/PDIF Rx/Tx	4x SAI//I2S, 1x ESAI, 1x S/PDIF Rx/Tx	ESAI, I2S/SSI x3	3x I2S/SAI, 1 x S/PDIF Tx/Rx

· 제품 사양

SPECIFICATIONS	Digi ConnectCore® 8X	Digi ConnectCore® 8X Dual
APPLICATION PROCESSOR	NXP® i.MX8QuadXPlus 4x Cortex®-A35 cores @ 1.2 GHz 1x Cortex-M4F @ 266 MHz core for real-time processing 1x Tensilica® Hi-Fi 4 DSP	NXP® i.MX8DualXZ 2x Cortex®-A35 cores @ 1.2 GHz
MEMORY	Up to 64 GB eMMC, up to 4 GB of LPDDR4
PMIC	NXP PF8100
GRAPHICS	Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders	H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders
SECURITY	Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
PERIPHERALS/ INTERFACES**	1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC), 5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4); 8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support), 4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG	1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC), 5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4); 8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support), 4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG
ETHERNET	2x 10/100/1000M Ethernet + AVB
WI-FI	802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz 802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm) 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm) 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7 802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9 Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate. Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready
BLUETOOTH	Bluetooth® 5
ON-MODULE MICROCONTROLLER ASSIST	Digi Microcontroller Assist™ Independent Cortex-M0+ microcontroller subsystem Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE	Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)
STORAGE TEMPERATURE	-50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY	5% to 90% (non-condensing)
RADIO APPROVALS	US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY	FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
DESIGN VERIFICATION	Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS	118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 5.4 mm (1.6 in x 1.8 in x 0.21 in)

*PCIe is only supported on wired variants
**Each single PHY can either be a 1 x 4 lane MIPI-DSI or a 1 x 1 channel LVDS interface for a total of 2 display interfaces. In combination, the two PHYs can be configured to be a single 2-channel LVDS interface.

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