General

Application Processor

On-board ConnectCore 6 multi-chip module with NXP i.MX6Quad/i.MX6Dual/i.MX6DualLite, Industrial (800 MHz) and extended commercial (1.2 GHz) options

Memory

4 GB eMMC, 512 MB/1GB DDR (64-bit)

Graphics

Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families
Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support
Separate 2D and/or Vertex acceleration engines for UI support
Stereoscopic image sensor support for 3D imaging.

Security

RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)

Displays

1 x HDMI (Type A)
2 x LVDS with backlight control and I2C touch interface (Hirose DF14A-20P-1.25H and Molex 53047-1410)
1 x Parallel LCD (24-bit) with backlight control and I2C touch interface (Omron XF2M-4015-1A)
1 x MIPI-DSI with backlight control and I2C touch interface (Omron XF2M-2015-1A)

Camera

1 x 8-Bit Parallel Camera Interface 1 (Omron XF2M-2015-1A)
1 x 8-Bit Parallel Camera Interface 0 (Molex 53047-1410)
1 x MIPI CSI-2 (FCI SFW15S-2STE1LF, compatible with Raspberry Pi CSI)

USB 2.0

2 x USB Host (Dual Type A)
1 x USB OTG (Micro AB)
1 x USB Host (Molex 53047-0610)

Audio

1 x Line-In (3.5 mm stereo jack, CUI SJ1-3515-SMT)
1 x Line-In, 1 x Line-Out, 1 x Mic-In (Molex 53047-0810)
On-board Freescale SGTL5000 audio codec

Console (RS232)

Molex 53047-0310

SATA 3.0

3M 5607-5102-SH

Micro-SIM

Yes

PCI Express Mini Card

Foxconn AS0B226-S68Q-7H
Provides PCI Express x1, USB 2.0 Host, I2C, SIM, Reset, Wake-Up signals
Supports mounting of half-size and full-size PCI Express Mini Cards

Boot Configuration

eMMC / SD / SATA

XBee Socket

Samtec MMS-110-01-L-SV

Wi-Fi

802.11a/b/g/n: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm), HT40, MCS 0-7
Security: WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i, Access Point Mode, Wi-Fi Direct
Industry Certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready

Bluetooth

Class 1.5, Bluetooth 2.1 + EDR, Bluetooth 3.0 + HS 802.11 AMP, Bluetooth Low Energy Profiles: GAP, SPP, HSP, HFP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP

Antenna Connectors

1 x U.FL / 2 x U.FL

Gigabit Ethernet

RJ-45, with 2 LEDs for link/speed/activity

CAN Bus

2 x FlexCAN (Molex 53047-0610)

GPIO/I2C/SPI/UART

1 x GPIO (8 x i.MX GPIOs + 4 Kinetis GPIOs, Molex 53047-1410)
1 x I2C (Molex 53047-0310), 1 x SPI (Molex 53047-0610)
3 x UART (4-wire TX/RX/RTS/CTS, 1 shared with XBee socket, Molex 53047-1410)

Debug

1 x JTAG for i.MX6 (FCI 20021111-00010T4LF)
1 x SWD for Kinetis MCA (FCI 20021111-00010T4LF)
Headers populated on development units only
Production units without header for plug of nails (Tag-Connect TC2050-IDC-NL)

Power Button

Power on, power off, sleep, wake-up

Reset Button

Yes

User LEDs

1 x Red, 1 x Yellow, 1 x Green

Coin Cell Connector

Molex 53047-0210

Supply Voltage

5 VDC @ 500 mA (typical, depending on use-case)

Power Supply Connector

Main power supply via 2mm locking barrel connector

Operating Temperature

-20° C to +70° C / -40° C to +85° C

Storage Temperature

-50° C to +125° C

Relative Humidity

Relative Humidity 5% to 90% (non-condensing)

Radio Approvals

US, Canada, EU, Japan, Australia/New Zealand

Emissions / Immunity / Safety

FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)

Operational Reliability

Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT

Mechanical Dimensions

Pico-ITX form factor, 72 mm x 100 mm

Product Warranty

1 year