Digi ConnectCore MP1  

Intelligent, wireless and secure embedded system-on-module based on the STM32MP1 MPU family, with turnkey Linux support in the robust Digi SMTplus standard form factor

Digi ConnectCore 93  

Embedded, wireless system-on-module based on the NXP i.MX 93 processor, with AI/ML NPU, designed for longevity and scalability in industrial IoT applications

Digi ConnectCore 8M Mini 

Embedded system-on-module based on the NXP i.MX 8M Mini processor with built-in Video Processing Unit (VPU); designed for longevity and scalability in industrial IoT applications. 

Digi ConnectCore 8M Nano 

Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed for longevity and scalability in industrial IoT applications 

Digi ConnectCore 8X 

Intelligent and connected embedded system-on-module based on the NXP i.MX 8X, with scalable dual/quad-core performance for industrial IoT applications 

Digi ConnectCore 6+ 

NXP i.MX6Plus based surface-mount module solution with scalable, quad-core performance and integrated wireless 

Digi ConnectCore 6UL 

Intelligent and connected embedded system-on-module based on the NXP i.MX6 UL, with turnkey Linux software support in a stamp-sized form factor 

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Ethernet

10/100 M or Gigabit Ethernet GMAC IEEE 1588v2, MII/RMII/GMII/RGMII

2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)

10/100/1000M Ethernet + AVB

1x 10/100/1000M Ethernet + AVB

2x 10/100/1000M Ethernet + AVB

10/100/1000 Mbit/s

Dual 10/100 Mbit/s

Graphics

3D GPU (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, parallel LCD-TFT controller, MIPI® DSI 2 data lanes

2D GPU, 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY, 1x 720p 60 LVDS (4-lane), 18-bit parallel RGB

Graphics Processing Unit: GCNanoUltra for 3D acceleration, GC320 for 2D acceleration, LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI, DSI MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface); Video Processing Unit: 1080 p 60 HEVC H.265 (decode), VP9, H.264, VP8 (encode/decode)

GC7000UL with OpenCL and Vulkan support, 2 shader, 123 million triangles / sec, 0.8 giga pixel / sec, 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit, supports OpenGL ES 1.1, 2.0, 3.0, OpenCL, shader clock frequency of 500 MHz LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI, MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)

Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders

Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging

2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768)

Operating Temperature

Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design

Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design

Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design

Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design

Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)

Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design

Industrial: -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design

Processor Family

ST STM32MP157C, Arm® dual Cortex®-A7 at 650 MHz
Cortex®-M4 at 209 MHz with FPU/MPU, 3D GPU, secure boot, crypto engine

NXP® i.MX 93
Up to 2x Cortex®-A55 cores at 1.7 GHz
1x Cortex-M33 core at 250 MHz core for real-time processing

NXP® i.MX 8M Mini
Four Cortex®-A53 cores @ 1.6 GHz
Cortex-M4 core @ 400 MHz

NXP® i.MX 8M Nano
1-4x Cortex®-A53 cores @ 1.4 GHz
1x Cortex-M7 core @ 600 MHz

NXP® i.MX 8QuadXPlus
Up to 4x Cortex®-A35 cores @ 1.2 GHz
1x Cortex-M4F core @ 264 MHz
1x Tensilica® Hi-Fi 4 DSP

NXP® i.MX6 Plus
4x Cortex®-A9 @ 1.2 GHz

NXP i.MX6UL-2
1x Cortex-A7 @ 528 MHz

Wireless

Wi-Fi 5 dual-band 802.11a/b/g/n/ac 1x1 radio (up to 433.3 Mbps) with full temperature range; Bluetooth® 5

Wi-Fi 6 802.11ax dual-band 1x1 wireless, Bluetooth® 5.2, 802.15.4

802.11a/b/g/n/ac, Bluetooth® 5

802.11a/b/g/n/ac, Bluetooth® 5

802.11a/b/g/n/ac, Bluetooth® 5

802.11a/b/g/n/ac, Bluetooth® 5

802.11a/b/g/n/ac, Bluetooth® 5

Flash

Up to 1 GB SLC NAND

Up to 32 GB eMMC

Up to 8 GB eMMC

Up to 8 GB eMMC

Up to 64 GB eMMC

Up to 64 GB eMMC

Up to 2 GB NAND (SLC)

RAM

Up to 1 GB DDR3L

Up to 2 GB of LPDDR4 / LPDDR4X

Up to 2 GB LPDDR4

Up to 1 GB of LPDDR4

Up to 4 GB LPDDR4

Up to 2 GB DDR3

Up to 1 GB DDR3

Software Support

Digi Embedded Yocto Linux

Digi Embedded Yocto Linux

Yocto Project Linux, Android

Yocto Project® Linux®

Yocto Project® Linux®, Android™

Yocto Project® Linux®, Android™

Yocto Project® Linux®

Other

Digi Microcontroller Assist™, ultra-low power Arm® Cortex®-M0+

AI/ML Arm Ethos U65 micro neural processor; Digi Microcontroller Assist™ independent Cortex-M0+ microcontroller subsystem supporting ultra-low power modes

Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA

Digi Microcontroller Assist™, independent Cortex-M0+ microcontroller subsystem, supporting ultra-low power modes @ <3μA

-

Up to 4 displays, up to 3 cameras, Kinetis Micro Controller Assist (MCA)

Digi Microcontroller Assist™ (MCA), Secure Element (SE)

Processor Cores

-

-

4

4

Up to 4

Up to 4

1

Processor Architecture

-

-

64-bit

64-Bit

64-Bit

32-Bit

32-Bit

I/O

-

-

USB 2.0 OTG controllers with integrated PHY interfaces, three Ultra Secure Digital Host Controller (uSDHC) interfaces, Gigabit Ethernet controller, four Universal Asynchronous Receiver / Transmitter (UART) modules, four I2C modules, three SPI modules, PCI Express 2.0 (PCIe)

1x USB 2.0 OTG controllers with integrated PHY interfaces, 3x Ultra Secure Digital Host Controller (uSDHC) interfaces, 1x Gigabit Ethernet controller, 4x Universal Asynchronous Receiver / Transmitter (UART) modules, 4x I2C modules, 3x SPI modules

1x SD 3.0 card interface handles SD/SDIO/MMC protocols, 5x UARTs (4x Cortex-A35 core, 1x Cortex-M4), S/PDIF Tx/Rx, 8x I2C, 4x SPI, ESAI, 4x I2S/SSI, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG

MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC, External address/data bus, Watchdog, Timers, JTAG, External Memory Bus

1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs, 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)

Audio

-

-

5x SAI/I2S, 1x S/PDIF Rx/Tx

5x SAI/I2S, 1x S/PDIF Rx/Tx

4x SAI//I2S, 1x ESAI, 1x S/PDIF Rx/Tx

ESAI, I2S/SSI x3

3x I2S/SAI, 1 x S/PDIF Tx/Rx